Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694960 | Bridge interconnection with layered interconnect structures | Yueli Liu, Qinglei Zhang, Rui Zhang | 2023-07-04 |
| 11631595 | High density organic interconnect structures | Sri Chaitra Jyotsna Chavali, Siddharth K. Alur, Lilia May | 2023-04-18 |