| 11842981 |
Die interconnect substrates, a semiconductor device and a method for forming a die interconnect substrate |
Rahul Jain, Ji-Yong Park |
2023-12-12 |
| 11735537 |
Methods to embed magnetic material as first layer on coreless substrates and corresponding structures |
Cheng Xu, Junnan Zhao, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more |
2023-08-22 |
| 11664290 |
Package with underfill containment barrier |
Rahul Jain, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta, Ashish Dhall +4 more |
2023-05-30 |
| 11651885 |
Magnetic core inductors |
Junnan Zhao, Ying Wang, Cheng Xu, Sheng Li, Yikang Deng |
2023-05-16 |
| 11610706 |
Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates |
Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Sheng Li, Andrew J. Brown +1 more |
2023-03-21 |
| 11581271 |
Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate |
Rahul Jain, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more |
2023-02-14 |
| 11557489 |
Cavity structures in integrated circuit package supports |
Rahul Jain, Sai Vadlamani, Junnan Zhao, Ji-Yong Park, Cheng Xu |
2023-01-17 |