Issued Patents 2023
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830809 | Magnetic structures in integrated circuit package supports | Yikang Deng, Junnan Zhao, Andrew J. Brown, Cheng Xu, Kaladhar Radhakrishnan | 2023-11-28 |
| 11789047 | Steady state fault current calculation method for modular multilevel converter | Jinghan He, Meng Li, Yiping Luo, Xiaojun Wang, Yin Xu +5 more | 2023-10-17 |
| 11765771 | Fallback procedures for two-step random access procedures | Jing Lei, Linhai HE, Hung Dinh LY, Seyong Park, Naga Bhushan +2 more | 2023-09-19 |
| 11728952 | Channel quality indicator (CQI) reporting for ultra-reliable low latency communications (URLLC) | Gabi Sarkis, Jing Jiang, Wanshi Chen, Wei Yang, Chih-Ping Li | 2023-08-15 |
| 11721677 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Cheng Xu, Junnan Zhao, Meizi Jiao | 2023-08-08 |
| 11705389 | Vias for package substrates | Andrew J. Brown, Luke Garner, Liwei Cheng, Lauren A. Link, Cheng Xu +2 more | 2023-07-18 |
| 11696407 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Junnan Zhao, Cheng Xu, Yikang Deng | 2023-07-04 |
| 11694134 | Optimization method and device of crew replanning for high-speed railway in typical scenarios | Jinchuan ZHANG, Jianrui Miao, Lingyun Meng, Xinyue Xu | 2023-07-04 |
| 11651885 | Magnetic core inductors | Junnan Zhao, Cheng Xu, Kyu Oh Lee, Sheng Li, Yikang Deng | 2023-05-16 |
| 11646254 | Electronic device including a lateral trace | Yikang Deng, Cheng Xu, Chong Zhang, Junnan Zhao | 2023-05-09 |
| 11557579 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Cheng Xu, Junnan Zhao, Meizi Jiao | 2023-01-17 |
| 11552008 | Asymmetric cored integrated circuit package supports | Lauren A. Link, Andrew J. Brown, Prithwish Chatterjee, Sai Vadlamani, Chong Zhang | 2023-01-10 |