Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11705389 | Vias for package substrates | Andrew J. Brown, Liwei Cheng, Lauren A. Link, Cheng Xu, Ying Wang +2 more | 2023-07-18 |
| 11676873 | Semiconductor package having sealant bridge | Dinesh Padmanabhan Ramalekshmi Thanu, Hemanth K. Dhavaleswarapu, Venkata Suresh R. Guthikonda, John J. Beatty, Yonghao An +2 more | 2023-06-13 |