Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11849790 | Apparel fitting simulation based upon a captured two-dimensional human body posture image | Wei-Shan Hu | 2023-12-26 |
| 11769719 | Dual trace thickness for single layer routing | Jonathan L. Rosch, Wei-Lun Kane Jen, Cheng Xu, Andrew J. Brown, Yikang Deng | 2023-09-26 |
| 11705389 | Vias for package substrates | Andrew J. Brown, Luke Garner, Lauren A. Link, Cheng Xu, Ying Wang +2 more | 2023-07-18 |