Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804455 | Substrate integrated thin film capacitors using amorphous high-k dielectrics | Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Henning Braunisch, Andrew J. Brown | 2023-10-31 |
| 11651902 | Patterning of thin film capacitors in organic substrate packages | Rahul Jain, Andrew J. Brown, Sai Vadlamani, Lauren A. Link | 2023-05-16 |
| 11610706 | Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates | Sai Vadlamani, Rahul Jain, Kyu Oh Lee, Sheng Li, Andrew J. Brown +1 more | 2023-03-21 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more | 2023-02-07 |
| 11552008 | Asymmetric cored integrated circuit package supports | Lauren A. Link, Andrew J. Brown, Sai Vadlamani, Ying Wang, Chong Zhang | 2023-01-10 |