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Microelectronic assemblies having conductive structures with different thicknesses |
Brandon C. Marin, Andrew J. Brown, Rahul Jain, Dilan Seneviratne, Frank Truong |
2023-08-22 |
| 11688692 |
Embedded multi-die interconnect bridge having a substrate with conductive pathways and a molded material region with through-mold vias |
Frank Truong, Jason M. Gamba, Robert Alan May |
2023-06-27 |
| 11652071 |
Electronic device package including a capacitor |
Brandon C. Marin, Shivasubramanian Balasubramanian, Rahul Jain, Jeremy Ecton |
2023-05-16 |
| 11571876 |
Dielectric film with pressure sensitive microcapsules of adhesion promoter |
Frank Truong, Dilan Seneviratne |
2023-02-07 |
| 11574874 |
Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch |
Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Srinivas V. Pietambaram +4 more |
2023-02-07 |