Issued Patents 2023
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854834 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Chung Kwang Christopher Tan, Aleksandar Aleksov | 2023-12-26 |
| 11855125 | Capacitors with nanoislands on conductive plates | Brandon C. Marin, Jeremy Ecton, Hiroki Tanaka, Frank Truong | 2023-12-26 |
| 11824018 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Bharat P. Penmecha | 2023-11-21 |
| 11817349 | Conductive route patterning for electronic substrates | Jeremy Ecton, Brandon C. Marin, Leonel Arana, Matthew Tingey, Oscar Ojeda +3 more | 2023-11-14 |
| 11810859 | Multi-layered adhesion promotion films | Rahul N. Manepalli, Cemil Geyik, Kemal Aygun | 2023-11-07 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Tarek A. Ibrahim, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2023-10-24 |
| 11791269 | Electrical interconnect bridge | Rahul N. Manepalli | 2023-10-17 |
| 11780210 | Glass dielectric layer with patterning | Jieying Kong, Gang Duan, Patrick QUACH, Dilan Seneviratne | 2023-10-10 |
| 11769735 | Chiplet first architecture for die tiling applications | Gang Duan, Deepak Kulkarni, Rahul N. Manepalli, Xiaoying Guo | 2023-09-26 |
| 11756890 | Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications | Rahul N. Manepalli, Gang Duan | 2023-09-12 |
| 11744161 | Magnetoresistive stacks with an unpinned, fixed synthetic anti-ferromagnetic structure and methods of manufacturing thereof | Bengt J. Akerman, Renu Whig, Jason Janesky, Nicholas Rizzo, Jon Slaughter | 2023-08-29 |
| 11735533 | Heterogeneous nested interposer package for IC chips | Debendra Mallik, Ravindranath V. Mahajan, Robert L. Sankman, Shawna M. Liff, Bharat P. Penmecha | 2023-08-22 |
| 11735531 | Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers | Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez, Kwangmo Chris Lim | 2023-08-22 |
| 11728265 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Brandon C. Marin, Frank Truong, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li +4 more | 2023-08-15 |
| 11699648 | Electromigration resistant and profile consistent contact arrays | Jung Kyu Han, Ali Lehaf, Steve Cho, Thomas HEATON, Hiroki Tanaka +3 more | 2023-07-11 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Tarek A. Ibrahim, Andrew J. Brown, Gang Duan, Jeremy Ecton +1 more | 2023-04-04 |
| 11600563 | Molded embedded bridge including routing layers for enhanced EMIB applications | Rahul N. Manepalli | 2023-03-07 |
| 11574993 | Package architecture with tunable magnetic properties for embedded devices | Rengarajan Shanmugam, Suddhasattwa Nad, Darko Grujicic | 2023-02-07 |
| 11574874 | Package architecture utilizing photoimageable dielectric (PID) for reduced bump pitch | Robert Alan May, Sri Ranga Sai Boyapati, Kristof Darmawikarta, Hiroki Tanaka, Frank Truong +4 more | 2023-02-07 |