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Packaging for RF transistor amplifiers |
Basim Noori, Marvin Marbell, Scott Sheppard, Alexander Komposch, Qianli Mu |
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Group III nitride-based radio frequency amplifiers having back side source, gate and/or drain terminals |
Michael E. Watts, Mario M. Bokatius, Jangheon Kim, Basim Noori, Qianli Mu +1 more |
2023-12-05 |
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Panel level packaging for multi-die products interconnected with very high density (VHD) interconnect layers |
Srinivas V. Pietambaram, Sri Ranga Sai Boyapati, Robert Alan May, Kristof Darmawikarta, Javier Soto Gonzalez |
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RF amplifier devices including interconnect structures and methods of manufacturing |
Basim Noori, Marvin Marbell, Scott Sheppard, Alexander Komposch, Qianli Mu |
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Method of manufacturing an electronic device and electronic device manufactured thereby |
Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Ji Young Chung |
2023-02-28 |