Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11682598 | Sensor package and manufacturing method thereof | Dong Joo Park, Jin Seong Kim, Jae Sung Park, Se Hwan Hong | 2023-06-20 |
| 11600582 | Semiconductor device with redistribution layers formed utilizing dummy substrates | Jin Young Kim, Doo Hyun Park, Choon Heung Lee | 2023-03-07 |
| 11594512 | Method of manufacturing an electronic device and electronic device manufactured thereby | Hwan Kyu Kim, Dae Gon Kim, Tae Kyeong Hwang, Kwangmo Chris Lim | 2023-02-28 |