Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791228 | Method for forming embedded grounding planes on interconnect layers | Brandon C. Marin, Kristof Darmawikarta, Roy Dittler, Jeremy Ecton | 2023-10-17 |
| 11728265 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Brandon C. Marin, Frank Truong, Shivasubramanian Balasubramanian, Dilan Seneviratne, Yonggang Li +4 more | 2023-08-15 |
| 11574993 | Package architecture with tunable magnetic properties for embedded devices | Rengarajan Shanmugam, Suddhasattwa Nad, Srinivas V. Pietambaram | 2023-02-07 |