Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791228 | Method for forming embedded grounding planes on interconnect layers | Brandon C. Marin, Kristof Darmawikarta, Jeremy Ecton, Darko Grujicic | 2023-10-17 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11791228 | Method for forming embedded grounding planes on interconnect layers | Brandon C. Marin, Kristof Darmawikarta, Jeremy Ecton, Darko Grujicic | 2023-10-17 |