Issued Patents 2023
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11780210 | Glass dielectric layer with patterning | Jieying Kong, Gang Duan, Srinivas V. Pietambaram, Patrick QUACH | 2023-10-10 |
| 11737208 | Microelectronic assemblies having conductive structures with different thicknesses | Brandon C. Marin, Andrew J. Brown, Rahul Jain, Praneeth Akkinepally, Frank Truong | 2023-08-22 |
| 11728265 | Selective deposition of embedded thin-film resistors for semiconductor packaging | Brandon C. Marin, Frank Truong, Shivasubramanian Balasubramanian, Yonggang Li, Sameer Paital +4 more | 2023-08-15 |
| 11670504 | Ultra-thin dielectric films using photo up-conversion for applications in substrate manufacturing and integrating passives | Jeremy Ecton, Brandon C. Marin, Andrew J. Brown | 2023-06-06 |
| 11637171 | Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same | Shivasubramanian Balasubramanian | 2023-04-25 |
| 11605867 | Fabricating an RF filter on a semiconductor package using selective seeding | Brandon C. Marin, Jeremy Ecton, Aleksandar Aleksov, Kristof Darmawikarta, Yonggang Li | 2023-03-14 |
| 11571876 | Dielectric film with pressure sensitive microcapsules of adhesion promoter | Praneeth Akkinepally, Frank Truong | 2023-02-07 |