Issued Patents 2023
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11854834 | Integrated circuit package supports | Kristof Darmawikarta, Robert Alan May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Aleksandar Aleksov | 2023-12-26 |
| 11721631 | Via structures having tapered profiles for embedded interconnect bridge substrates | Jeremy Ecton, Hiroki Tanaka, Oscar Ojeda, Arnab Roy, Vahidreza Parichehreh +2 more | 2023-08-08 |
| 11676891 | Method to enable 30 microns pitch EMIB or below | Hongxia Feng, Dingying Xu, Sheng Li, Matthew Tingey, Meizi Jiao | 2023-06-13 |