Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11676891 | Method to enable 30 microns pitch EMIB or below | Dingying Xu, Sheng Li, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan | 2023-06-13 |
| 11640934 | Lithographically defined vertical interconnect access (VIA) in dielectric pockets in a package substrate | Meizi Jiao, Chong Zhang, Kevin Thomas McCarthy | 2023-05-02 |