Sheng Li — 6 Patents at Intel | Patent Leaderboard

Issued Patents 2023

Showing 1–6 of 6 patents

Patent #	Title	Co-Inventors	Date	Approx Value ⓘ
11824013	Package substrate with reduced interconnect stress	Lauren A. Link, Andrew J. Brown, Sandeep B. Sane	2023-11-21	$28,968,000
11676891	Method to enable 30 microns pitch EMIB or below	Hongxia Feng, Dingying Xu, Matthew Tingey, Meizi Jiao, Chung Kwang Christopher Tan	2023-06-13	$22,204,000
11651885	Magnetic core inductors	Junnan Zhao, Ying Wang, Cheng Xu, Kyu Oh Lee, Yikang Deng	2023-05-16	$11,130,000
11622448	Sandwich-molded cores for high-inductance architectures	Brandon C. Marin, Tarek A. Ibrahim, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan +1 more	2023-04-04	$21,090,000
11610706	Release layer-assisted selective embedding of magnetic material in cored and coreless organic substrates	Sai Vadlamani, Prithwish Chatterjee, Rahul Jain, Kyu Oh Lee, Andrew J. Brown +1 more	2023-03-21	$20,076,000
11581271	Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate	Rahul Jain, Kyu Oh Lee, Islam A. Salama, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen +1 more	2023-02-14	$12,790,000