Issued Patents 2023
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11830809 | Magnetic structures in integrated circuit package supports | Ying Wang, Yikang Deng, Andrew J. Brown, Cheng Xu, Kaladhar Radhakrishnan | 2023-11-28 |
| 11735537 | Methods to embed magnetic material as first layer on coreless substrates and corresponding structures | Cheng Xu, Kyu Oh Lee, Rahul Jain, Ji-Yong Park, Sai Vadlamani +1 more | 2023-08-22 |
| 11721677 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Cheng Xu, Ying Wang, Meizi Jiao | 2023-08-08 |
| 11696407 | Core layer with fully encapsulated co-axial magnetic material around PTH in IC package substrate | Chong Zhang, Ying Wang, Cheng Xu, Yikang Deng | 2023-07-04 |
| 11651885 | Magnetic core inductors | Ying Wang, Cheng Xu, Kyu Oh Lee, Sheng Li, Yikang Deng | 2023-05-16 |
| 11646254 | Electronic device including a lateral trace | Yikang Deng, Ying Wang, Cheng Xu, Chong Zhang | 2023-05-09 |
| 11557489 | Cavity structures in integrated circuit package supports | Rahul Jain, Sai Vadlamani, Ji-Yong Park, Kyu Oh Lee, Cheng Xu | 2023-01-17 |
| 11557579 | Microelectronic assemblies having an integrated capacitor | Chong Zhang, Cheng Xu, Ying Wang, Meizi Jiao | 2023-01-17 |