Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11824013 | Package substrate with reduced interconnect stress | Lauren A. Link, Andrew J. Brown, Sheng Li | 2023-11-21 |
| 11557541 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan +7 more | 2023-01-17 |