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Modular periphery tile for integrated circuit device |
Chee Hak Teh, Ankireddy Nalamalpu, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang |
2023-08-01 |
| 11669472 |
Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package |
Lai Guan Tang, Ankireddy Nalamalpu, Dheeraj Subbareddy, Chee Hak Teh |
2023-06-06 |
| 11664317 |
Reverse-bridge multi-die interconnect for integrated-circuit packages |
Min Suet Lim, Eng Huat Goh |
2023-05-30 |
| 11658144 |
Innovative interconnect design for package architecture to improve latency |
Ankireddy Nalamalpu, Dheeraj Subbareddy |
2023-05-23 |
| 11610856 |
Connectivity between integrated circuit dice in a multi-chip package |
Robert Sankman, Dheeraj Subbareddy, Ankireddy Nalamalpu |
2023-03-21 |
| 11595045 |
Programmable logic device with fine-grained disaggregation |
Dheeraj Subbareddy, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler |
2023-02-28 |
| 11557541 |
Interconnect architecture with silicon interposer and EMIB |
Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan, Debendra Mallik +7 more |
2023-01-17 |