Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11726932 | Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices | George Chong Hean Ooi, Chee Hak Teh | 2023-08-15 |
| 11714941 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt | 2023-08-01 |
| 11669472 | Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package | Ankireddy Nalamalpu, Dheeraj Subbareddy, Chee Hak Teh, MD Altaf Hossain | 2023-06-06 |
| 11670589 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Han Wooi Lim, Hee Kong Phoon | 2023-06-06 |
| 11621713 | High-speed core interconnect for multi-die programmable logic devices | Ankireddy Nalamalpu, Dheeraj Subbareddy | 2023-04-04 |