Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670589 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Lai Guan Tang, Hee Kong Phoon | 2023-06-06 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11670589 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Hak Teh, Chee Seng Leong, Lai Guan Tang, Hee Kong Phoon | 2023-06-06 |