Issued Patents 2023
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11829643 | Memory controller system and a method of pre-scheduling memory transaction for a storage device | Yu Ying Ong, Weng Li Leow, Muhamad Aidil Jazmi | 2023-11-28 |
| 11741042 | Scalable 2.5D interface circuitry | Arifur Rahman | 2023-08-29 |
| 11726932 | Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices | George Chong Hean Ooi, Lai Guan Tang | 2023-08-15 |
| 11714941 | Modular periphery tile for integrated circuit device | Ankireddy Nalamalpu, MD Altaf Hossain, Dheeraj Subbareddy, Sean R. Atsatt, Lai Guan Tang | 2023-08-01 |
| 11670589 | Fabric die to fabric die interconnect for modularized integrated circuit devices | Chee Seng Leong, Lai Guan Tang, Han Wooi Lim, Hee Kong Phoon | 2023-06-06 |
| 11669472 | Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package | Lai Guan Tang, Ankireddy Nalamalpu, Dheeraj Subbareddy, MD Altaf Hossain | 2023-06-06 |
| 11609709 | Memory controller system and a method for memory scheduling of a storage device | Yu Ying Ong | 2023-03-21 |
| 11580054 | Scalable network-on-chip for high-bandwidth memory | Yu Ying Ong, George Chong Hean Ooi | 2023-02-14 |
| 11575383 | Clocking system and a method of clock synchronization | Yu Ying Ong, Wong Ging Yeon Mark, Tat Hin Tan, Soong Khim Chew | 2023-02-07 |