Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652026 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Wai Ling Lee | 2023-05-16 |
| 11575383 | Clocking system and a method of clock synchronization | Chee Hak Teh, Yu Ying Ong, Wong Ging Yeon Mark, Soong Khim Chew | 2023-02-07 |