Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652026 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan | 2023-05-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11652026 | Micro through-silicon via for transistor density scaling | Bok Eng Cheah, Choong Kooi Chee, Jackson Chung Peng Kong, Tat Hin Tan | 2023-05-16 |