Issued Patents 2023
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11789883 | Inter-die communication of programmable logic devices | Sharath Raghava, Kavitha Prasad, Ankireddy Nalamalpu, Harsha Gupta | 2023-10-17 |
| 11714941 | Modular periphery tile for integrated circuit device | Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Sean R. Atsatt, Lai Guan Tang | 2023-08-01 |
| 11700002 | Network-on-chip (NOC) with flexible data width | Sharath Raghava, Ankireddy Nalamalpu, Harsha Gupta, James Ball, Kavitha Prasad +1 more | 2023-07-11 |
| 11669472 | Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package | Lai Guan Tang, Ankireddy Nalamalpu, Chee Hak Teh, MD Altaf Hossain | 2023-06-06 |
| 11658144 | Innovative interconnect design for package architecture to improve latency | MD Altaf Hossain, Ankireddy Nalamalpu | 2023-05-23 |
| 11621713 | High-speed core interconnect for multi-die programmable logic devices | Lai Guan Tang, Ankireddy Nalamalpu | 2023-04-04 |
| 11610856 | Connectivity between integrated circuit dice in a multi-chip package | Robert Sankman, MD Altaf Hossain, Ankireddy Nalamalpu | 2023-03-21 |
| 11609262 | On-die aging measurements for dynamic timing modeling | Ankireddy Nalamalpu, Mahesh A. Iyer, Dhananjay Raghavan | 2023-03-21 |
| 11595045 | Programmable logic device with fine-grained disaggregation | MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler | 2023-02-28 |
| 11586579 | Multiple dies hardware processors and methods | Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati +10 more | 2023-02-21 |
| 11557541 | Interconnect architecture with silicon interposer and EMIB | MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Debendra Mallik +7 more | 2023-01-17 |