| 11789883 |
Inter-die communication of programmable logic devices |
Sharath Raghava, Kavitha Prasad, Ankireddy Nalamalpu, Harsha Gupta |
2023-10-17 |
| 11714941 |
Modular periphery tile for integrated circuit device |
Chee Hak Teh, Ankireddy Nalamalpu, MD Altaf Hossain, Sean R. Atsatt, Lai Guan Tang |
2023-08-01 |
| 11700002 |
Network-on-chip (NOC) with flexible data width |
Sharath Raghava, Ankireddy Nalamalpu, Harsha Gupta, James Ball, Kavitha Prasad +1 more |
2023-07-11 |
| 11669472 |
Frequency translation circuitry for an interconnection in an active interposer of a semiconductor package |
Lai Guan Tang, Ankireddy Nalamalpu, Chee Hak Teh, MD Altaf Hossain |
2023-06-06 |
| 11658144 |
Innovative interconnect design for package architecture to improve latency |
MD Altaf Hossain, Ankireddy Nalamalpu |
2023-05-23 |
| 11621713 |
High-speed core interconnect for multi-die programmable logic devices |
Lai Guan Tang, Ankireddy Nalamalpu |
2023-04-04 |
| 11610856 |
Connectivity between integrated circuit dice in a multi-chip package |
Robert Sankman, MD Altaf Hossain, Ankireddy Nalamalpu |
2023-03-21 |
| 11609262 |
On-die aging measurements for dynamic timing modeling |
Ankireddy Nalamalpu, Mahesh A. Iyer, Dhananjay Raghavan |
2023-03-21 |
| 11595045 |
Programmable logic device with fine-grained disaggregation |
MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Gregg William Baeckler |
2023-02-28 |
| 11586579 |
Multiple dies hardware processors and methods |
Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati +10 more |
2023-02-21 |
| 11557541 |
Interconnect architecture with silicon interposer and EMIB |
MD Altaf Hossain, Ankireddy Nalamalpu, Robert Sankman, Ravindranath V. Mahajan, Debendra Mallik +7 more |
2023-01-17 |