Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Connectivity between integrated circuit dice in a multi-chip package

Connectivity between integrated circuit dice in a multi-chip package

US Patent 11610856 · Granted Mar 21, 2023

Estimated economic value: $20,076,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Workload-dependent integrated circuit operation based on power headroom2025
Workload-dependent integrated circuit operation based on power headroom2025
Techniques for power management in compute circuits2025
Techniques for power management in compute circuits2025
Dynamic loadlines for programmable fabric devices2025
Dynamic loadlines for programmable fabric devices2025
Controlled transition between configuration mode and user mode to reduce current2025
Self-gating flops for dynamic power reduction2025
Self-gating flops for dynamic power reduction2025
Segmented row repair for programmable logic devices2025
Segmented row repair for programmable logic devices2025
Systems and methods to reduce voltage guardband2025