Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749649 | Composite IC chips including a chiplet embedded within metallization layers of a host IC chip | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff, Patrick Morrow, Van H. Le | 2023-09-05 |
| 11694986 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Mauro Kobrinksy +1 more | 2023-07-04 |
| 11652059 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Shawna M. Lift, Johanna M. Swan | 2023-05-16 |
| 11586579 | Multiple dies hardware processors and methods | Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Siva Soumya Eachempati, Tejpal Singh +10 more | 2023-02-21 |
| 11581282 | Serializer-deserializer die for high speed signal interconnect | Adel A. Elsherbini, Johanna M. Swan, Shawna M. Liff | 2023-02-14 |