{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Composite interposer structure and method of providing same", "item": "https://www.patentleaderboard.com/patent/11652059"}]}
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Home › Composite interposer structure and method of providing same

Composite interposer structure and method of providing same

US Patent 11652059 · Granted May 16, 2023

Estimated economic value: $11,130,000 ⓘ

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