Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Brandon M. Rawlings, Jagat Shakya, Johanna M. Swan +3 more | 2023-09-05 |
| 11652059 | Composite interposer structure and method of providing same | Adel A. Elsherbini, Johanna M. Swan, Gerald Pasdast | 2023-05-16 |