Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694986 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Van H. Le +1 more | 2023-07-04 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694986 | Vias in composite IC chip structures | Adel A. Elsherbini, Patrick Morrow, Johanna M. Swan, Shawna M. Liff, Van H. Le +1 more | 2023-07-04 |