Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11726932 | Network-on-chip for inter-die and intra-die communication in modularized integrated circuit devices | Lai Guan Tang, Chee Hak Teh | 2023-08-15 |
| 11580054 | Scalable network-on-chip for high-bandwidth memory | Chee Hak Teh, Yu Ying Ong | 2023-02-14 |