Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817390 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more | 2023-11-14 |
| 11798887 | Inorganic-based embedded-die layers for modular semiconductive devices | Srinivas V. Pietambaram, Kristof Darmawikarta, Rahul N. Manepalli, Debendra Mallik, Robert L. Sankman | 2023-10-24 |
| 11776864 | Corner guard for improved electroplated first level interconnect bump height range | Jacob VEHONSKY, Nicholas S. Haehn, Thomas HEATON, Steve Cho, Rahul Jain +4 more | 2023-10-03 |
| 11764150 | Inductors for package substrates | Sri Chaitra Jyotsna Chavali, Wei-Lun Kane Jen | 2023-09-19 |
| 11640942 | Microelectronic component having molded regions with through-mold vias | Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Jason M. Gamba, Manish Dubey +1 more | 2023-05-02 |
| 11622448 | Sandwich-molded cores for high-inductance architectures | Brandon C. Marin, Srinivas V. Pietambaram, Andrew J. Brown, Gang Duan, Jeremy Ecton +1 more | 2023-04-04 |