| 11817390 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2023-11-14 |
| 11798861 |
Integrated heat spreader (IHS) with heating element |
Peng Li, Kelly Lofgreen, Bamidele Daniel Falola, Ken Hackenberg, Shenavia S. Howell +3 more |
2023-10-24 |
| 11791274 |
Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects |
Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Sairam Agraharam, Mohit Bhatia +1 more |
2023-10-17 |
| 11670569 |
Channeled lids for integrated circuit packages |
Amitesh Saha, Marco Aurelio Cartas, Peng Li, Bamidele Daniel Falola |
2023-06-06 |
| 11640942 |
Microelectronic component having molded regions with through-mold vias |
Sanka Ganesan, Ram Viswanath, Xavier Francois Brun, Tarek A. Ibrahim, Jason M. Gamba +1 more |
2023-05-02 |
| 11545407 |
Thermal management solutions for integrated circuit packages |
Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more |
2023-01-03 |