Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817369 | Lids for integrated circuit packages with solder thermal interface materials | Bamidele Daniel Falola, Susmriti Das Mahapatra, Sergio Antonio Chan Arguedas, Peng Li | 2023-11-14 |
| 11670569 | Channeled lids for integrated circuit packages | Manish Dubey, Marco Aurelio Cartas, Peng Li, Bamidele Daniel Falola | 2023-06-06 |
| 11551997 | Thermal management solutions using self-healing polymeric thermal interface materials | Shushan Gong, Shrenik Kothari | 2023-01-10 |