Issued Patents 2023
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11817444 | Multi-chip packaging | Robert L. Sankman, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more | 2023-11-14 |
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Xavier Francois Brun, Kaizad Mistry, Paul R. Start, Nisha Ananthakrishnan, Yawei Liang +2 more | 2023-10-31 |
| 11791274 | Multichip semiconductor package including a bridge die disposed in a cavity having non-planar interconnects | Manish Dubey, Omkar G. Karhade, Nitin A. Deshpande, Jinhe Liu, Mohit Bhatia +1 more | 2023-10-17 |
| 11626372 | Metal-free frame design for silicon bridges for semiconductor packages | Dae-Woo Kim, Sujit Sharan | 2023-04-11 |