SO

Shengquan Ou

IN Intel: 1 patents #1,763 of 4,378Top 45%
Overall (2023): #254,973 of 537,848Top 50%
1
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11817444 Multi-chip packaging Robert L. Sankman, Sairam Agraharam, Thomas J. De Bonis, Todd Spencer, Yang Sun +1 more 2023-11-14