YS

Yang Sun

IN Intel: 1 patents #1,763 of 4,378Top 45%
Overall (2023): #199,144 of 537,848Top 40%
1
Patents 2023

Issued Patents 2023

Patent #TitleCo-InventorsDate
11817444 Multi-chip packaging Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer +1 more 2023-11-14