Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Xavier Francois Brun, Kaizad Mistry, Paul R. Start, Nisha Ananthakrishnan, Jigneshkumar P. Patel +2 more | 2023-10-31 |
| 11562940 | Integrated heat spreader comprising a silver and sintering silver layered structure | Elizabeth Nofen, James C. Matayabas, Jr., Yiqun Bai | 2023-01-24 |