Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749585 | High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package | Vipul V. Mehta, John C. DECKER, Ziyin Lin | 2023-09-05 |
| 11688634 | Trenches in wafer level packages for improvements in warpage reliability and thermals | Vipul V. Mehta, Ziyin Lin, John C. DECKER, Yan Li | 2023-06-27 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11562940 | Integrated heat spreader comprising a silver and sintering silver layered structure | Elizabeth Nofen, James C. Matayabas, Jr., Yawei Liang | 2023-01-24 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Mitul Modi, Edvin Cetegen +8 more | 2023-01-03 |