Issued Patents 2023
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749585 | High thermal conductivity, high modulus structure within a mold material layer of an integrated circuit package | Yiqun Bai, Vipul V. Mehta, Ziyin Lin | 2023-09-05 |
| 11688634 | Trenches in wafer level packages for improvements in warpage reliability and thermals | Vipul V. Mehta, Yiqun Bai, Ziyin Lin, Yan Li | 2023-06-27 |