| 11854932 |
Package wrap-around heat spreader |
Feras Eid, Chandra Mohan Jha |
2023-12-26 |
| 11832419 |
Full package vapor chamber with IHS |
Nicholas Neal, Nicholas S. Haehn, Kyle Arrington, Aaron McCann, Edvin Cetegen +4 more |
2023-11-28 |
| 11830783 |
Embedded substrate heat sink for bottom side cooling |
Aastha Uppal, Divya Mani |
2023-11-28 |
| 11804418 |
Direct liquid micro jet (DLMJ) structures for addressing thermal performance at limited flow rate conditions |
Nicholas Neal, Jae Whan Kim, Ravindranath V. Mahajan |
2023-10-31 |
| 11721607 |
Integrated circuit assemblies having metal foam structures |
Aastha Uppal |
2023-08-08 |
| 11676883 |
Thermoelectric coolers combined with phase-change material in integrated circuit packages |
Javed Shaikh, Kelly Lofgreen, Weihua Tang, Aastha Uppal |
2023-06-13 |
| 11670561 |
3D buildup of thermally conductive layers to resolve die height differences |
Zhimin Wan, Chandra Mohan Jha, Chia-Pin Chiu, Liwei Wang |
2023-06-06 |
| 11664294 |
Phase change materials for electromagnetic interference shielding and heat dissipation in integrated circuit assemblies |
Aastha Uppal, Weihua Tang, Minseok Ha |
2023-05-30 |
| 11574851 |
Coupled cooling fins in ultra-small systems |
Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Weihua Tang, Nitin A. Deshpande +6 more |
2023-02-07 |