Issued Patents 2023
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11798861 | Integrated heat spreader (IHS) with heating element | Peng Li, Manish Dubey, Bamidele Daniel Falola, Ken Hackenberg, Shenavia S. Howell +3 more | 2023-10-24 |
| 11756856 | Package architecture including thermoelectric cooler structures | Krishna Vasanth Valavala, Ravindranath V. Mahajan, Chandra Mohan Jha, Weihua Tang | 2023-09-12 |
| 11694942 | Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management | Chandra Mohan Jha, Krishna Vasanth Valavala | 2023-07-04 |
| 11676883 | Thermoelectric coolers combined with phase-change material in integrated circuit packages | Javed Shaikh, Je-Young Chang, Weihua Tang, Aastha Uppal | 2023-06-13 |
| 11658095 | Bump integrated thermoelectric cooler | Chandra Mohan Jha, Krishna Vasanth Valavala | 2023-05-23 |
| 11551994 | Liquid metal TIM with STIM-like performance with no BSM and BGA compatible | Chia-Pin Chiu, Joseph Petrini, Edvin Cetegen, Betsegaw K. Gebrehiwot, Feras Eid | 2023-01-10 |