Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11756856 | Package architecture including thermoelectric cooler structures | Ravindranath V. Mahajan, Chandra Mohan Jha, Kelly Lofgreen, Weihua Tang | 2023-09-12 |
| 11694942 | Annular silicon-embedded thermoelectric cooling devices for localized on-die thermal management | Kelly Lofgreen, Chandra Mohan Jha | 2023-07-04 |
| 11664293 | Solid state thermoelectric cooler in silicon backend layers for fast cooling in turbo scenarios | Ravindranath V. Mahajan, Chandra Mohan Jha | 2023-05-30 |
| 11658095 | Bump integrated thermoelectric cooler | Kelly Lofgreen, Chandra Mohan Jha | 2023-05-23 |