Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11735495 | Active package cooling structures using molded substrate packaging technology | Omkar G. Karhade, Edvin Cetegen, Aastha Uppal | 2023-08-22 |
| 11705377 | Stacked die cavity package | Robert L. Sankman, Debendra Mallik, Ravindranath V. Mahajan, Amruthavalli Pallavi Alur, Yikang Deng +1 more | 2023-07-18 |
| 11611164 | Wideband multi-pin edge connector for radio frequency front end module | Zhenguo Jiang, Omkar G. Karhade, Sri Chaitra Jyotsna Chavali, William J. Lambert, Zhichao Zhang | 2023-03-21 |
| 11574851 | Coupled cooling fins in ultra-small systems | Aastha Uppal, Omkar G. Karhade, Ram Viswanath, Je-Young Chang, Weihua Tang +6 more | 2023-02-07 |
| 11545407 | Thermal management solutions for integrated circuit packages | Kumar Abhishek Singh, Omkar G. Karhade, Nitin A. Deshpande, Edvin Cetegen, Aastha Uppal +8 more | 2023-01-03 |