Issued Patents 2023
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11804470 | Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage control | Xavier Francois Brun, Kaizad Mistry, Paul R. Start, Nisha Ananthakrishnan, Yawei Liang +2 more | 2023-10-31 |