| 11810859 |
Multi-layered adhesion promotion films |
Srinivas V. Pietambaram, Cemil Geyik, Kemal Aygun |
2023-11-07 |
| 11798887 |
Inorganic-based embedded-die layers for modular semiconductive devices |
Srinivas V. Pietambaram, Tarek A. Ibrahim, Kristof Darmawikarta, Debendra Mallik, Robert L. Sankman |
2023-10-24 |
| 11791269 |
Electrical interconnect bridge |
Srinivas V. Pietambaram |
2023-10-17 |
| 11769735 |
Chiplet first architecture for die tiling applications |
Srinivas V. Pietambaram, Gang Duan, Deepak Kulkarni, Xiaoying Guo |
2023-09-26 |
| 11756890 |
Hybrid fan-out architecture with EMIB and glass core for heterogeneous die integration applications |
Srinivas V. Pietambaram, Gang Duan |
2023-09-12 |
| 11694898 |
Hybrid fine line spacing architecture for bump pitch scaling |
Suddhasattwa Nad, Jeremy Ecton, Bai Nie, Marcel Wall |
2023-07-04 |
| 11664290 |
Package with underfill containment barrier |
Rahul Jain, Kyu Oh Lee, Siddharth K. Alur, Wei-Lun Kane Jen, Vipul V. Mehta +4 more |
2023-05-30 |
| 11658055 |
Customizable release layers to enable low warpage architectures for advanced packaging applications |
Suddhasattwa Nad |
2023-05-23 |
| 11646274 |
Multi-package assemblies having foam structures for warpage control |
Mufei Yu, Gang Duan, Edvin Cetegen, Baris Bicen |
2023-05-09 |
| 11600563 |
Molded embedded bridge including routing layers for enhanced EMIB applications |
Srinivas V. Pietambaram |
2023-03-07 |