Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Suddhasattwa Nad, Jeremy Ecton, Bai Nie, Rahul N. Manepalli | 2023-07-04 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11694898 | Hybrid fine line spacing architecture for bump pitch scaling | Suddhasattwa Nad, Jeremy Ecton, Bai Nie, Rahul N. Manepalli | 2023-07-04 |