Issued Patents 2023
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11764158 | Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling same | Amruthavalli Pallavi Alur, Sri Ranga Sai Boyapati, Robert Alan May, Robert L. Sankman | 2023-09-19 |
| 11581271 | Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrate | Rahul Jain, Kyu Oh Lee, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen, Yongki Min +1 more | 2023-02-14 |
| 11552019 | Substrate patch reconstitution options | Haifa Hariri, Amruthavalli Pallavi Alur, Wei-Lun Kane Jen | 2023-01-10 |