| 11824008 |
Multi-chip package and method of providing die-to-die interconnects in same |
Chia-Pin Chiu, Aleksandar Aleksov, Hinmeng Au, Stefanie M. Lotz, Johanna M. Swan +1 more |
2023-11-21 |
| 11804455 |
Substrate integrated thin film capacitors using amorphous high-k dielectrics |
Aleksandar Aleksov, Thomas L. Sounart, Kristof Darmawikarta, Prithwish Chatterjee, Andrew J. Brown |
2023-10-31 |
| 11791528 |
Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line |
Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, Zhichao Zhang, Yidnekachew S. Mekonnen +3 more |
2023-10-17 |
| 11764452 |
Integrated circuit including a dielectric waveguide with a cavity therein surrounded by a conductive coating forming a wall for the cavity |
Georgios Dogiamis, Adel A. Elsherbini, Telesphor Kamgaing, Johanna M. Swan |
2023-09-19 |
| 11756948 |
In situ package integrated thin film capacitors for power delivery |
Thomas L. Sounart, Aleksandar Aleksov |
2023-09-12 |
| 11728290 |
Waveguide fan-out |
Adel A. Elsherbini, Georgios Dogiamis, Johanna M. Swan, Aleksandar Aleksov, Telesphor Kamgaing |
2023-08-15 |
| 11721649 |
Microelectronic assemblies |
Adel A. Elsherbini, Patrick Morrow, Kimin Jun, Brennen Mueller, Shawna M. Liff +2 more |
2023-08-08 |
| 11716826 |
Platforms including microelectronic packages therein coupled to a chassis, where waveguides couple the microelectronic packages to each other and usable in a computing device |
Telesphor Kamgaing, Johanna M. Swan, Georgios Dogiamis, Adel A. Elsherbini, Aleksandar Aleksov +1 more |
2023-08-01 |
| 11715693 |
Dielectric waveguide channel for interconnecting dies in a semiconductor package usable in a computing device and method of manufacture |
Georgios Dogiamis, Aleksandar Aleksov, Adel A. Elsherbini, Johanna M. Swan, Telesphor Kamgaing |
2023-08-01 |
| 11664303 |
Interconnection structure fabrication using grayscale lithography |
Johanna M. Swan, Aleksandar Aleksov, Shawna M. Liff, Brandon M. Rawlings, Veronica Strong |
2023-05-30 |
| 11605603 |
Microelectronic package with radio frequency (RF) chiplet |
Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Johanna M. Swan, Shawna M. Liff +1 more |
2023-03-14 |
| 11581272 |
Contactless high-frequency interconnect |
Adel A. Elsherbini, Georgios Dogiamis, Telesphor Kamgaing, Richard J. Dischler, Johanna M. Swan +1 more |
2023-02-14 |