Issued Patents 2023
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11749628 | Sacrificial redistribution layer in microelectronic assemblies having direct bonding | Adel A. Elsherbini, Veronica Strong, Shawna M. Lift, Brandon M. Rawlings, Jagat Shakya +3 more | 2023-09-05 |
| 11721554 | Stress compensation for wafer to wafer bonding | Anant H. JAHAGIRDAR, Chytra Pawashe, Aaron D. Lilak, Myra McDonnell, Mauro J. Kobrinsky | 2023-08-08 |
| 11721649 | Microelectronic assemblies | Adel A. Elsherbini, Patrick Morrow, Henning Braunisch, Kimin Jun, Shawna M. Liff +2 more | 2023-08-08 |
| 11605565 | Three dimensional integrated circuits with stacked transistors | Cheng-Ying Huang, Willy Rachmady, Gilbert Dewey, Aaron D. Lilak, Kimin Jun +5 more | 2023-03-14 |
| 11594524 | Fabrication and use of through silicon vias on double sided interconnect device | Patrick Morrow, Kimin Jun, Paul B. Fischer, Daniel Pantuso | 2023-02-28 |